Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.

Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to…

Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.